IDF 2007: Intel gives Montevina centre stage

Chip giant Intel used its Intel Developer Forum (IDF) in San Francisco today to demonstrate the first working notebook built upon the next-generation Montevina platform.

The platform, which is due out in 2008 and based on the Penryn processor family and Cantiga chipset, will look to build upon the success of Santa Rosa.

Having already shown the connected components functioning within a perspex case, Intel mobility group's Dadi Perlmutter used his morning IDF keynote to bring out the first actual 15in notebook build.

Perlmutter gave several figures to demonstrate the progression from Santa Rosa, with a decrease from 35W to 25W thermal design power (TDP) the most notable. Intel also claims it will allow them to use motherboards at 60 per cent of current size, and the CPUs will use 25 per cent thinner packaging technology.

As detailed in IT PRO's sister title PC Pro's look at Penryn, Montevina notebooks will be able to drop into Deep Power-Down State, in which the L2 cache is powered off completely and the core voltage reduced to prolong battery life.

Montevina will also be the first Centrino platform to offer the option of integrated Wi-Fi and WiMAX wireless technologies. Codenamed Echo Peak, the technology comes in the form of a standard form-factor minicard or half-minicard, claimed to be no larger or more power-hungry than current technologies.

It was later revealed that an integrated TV tuner has also been developed as an optional part of the Montevina platform.

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